21 Apr
Package Design Engineer
Michigan, Ann arbor , 48103 Ann arbor USA

Vacancy expired!

Package Design Engineer for a Well Funded Global CompanyThis Jobot Job is hosted by: Alvin TruongAre you a fit? Easy Apply now by clicking the "Apply Now" button and sending us your resume.

A bit about us:We are a rapidly growing well-funded global company that is looking for a Senior or Principal Package Design Engineer to join our R&D Design team in designing unique custom packaging technology for our timing products. We have been around for 15 years and have a strong reputation as the market leader in innovative products in the Semiconductor space. If you are a Package Design Engineer with a strong background Semiconductor IC packaging and working with OSATs, Please apply today!

Why join us?
  • Strong Compensation & Benefits Package
  • Extensive PTO
  • Huge Room for Growth
  • Weekly Lunches & Fun Company Culture!
  • Great 401k Match
  • Health, Vision, Dental Benefits

Job DetailsThe Package Design Engineer is responsible for the R&D, design, and qualification of unique custompackaging technology for our revolutionary MEMS-based timing products. Responsibilitiesinclude new package technology development, packaging materials research and characterization,process development and optimization, simulation and design (including thermal, electrical,electromagnetic, mechanical, stress), package qualification and release-to-production.Responsibilities:
  • Develop new packaging technology for our MEMS-based timing solutions
  • Spearhead development of new packaging structures and technologies
  • Identify new materials, develop material models and characterization methodologies
  • Optimize recipes and processes to improve long-term device performance
  • Perform thermal/electrical/electromagnetic/mechanical/stress simulation and design
  • Lead troubleshooting activities related to package design or performance
Required Attributes:
  • MS or PhD in Mechanical Engineering, Material Science, or equivalent science field
  • Working knowledge of semiconductor IC packaging technology and methodology
  • Understanding of semiconductor packaging materials, such as epoxies, polymers, and solders
  • Hands-on experience with mechanical and thermal simulation and design
  • Hands-on experience with CAD software (AutoCAD preferred but not required)
  • Hands-on experience with finite element analysis (COMSOL preferred but not required)
Bonus:
  • Hands-on experience with IC package modelling software and techniques
  • MATLAB scripting ability
  • Hands-on familiarity with lab instruments such as oscilloscopes, frequency counters, etc.
  • Experience with material characterization techniques (DMA, TMA, TGA, etc.)
Interested in hearing more? Easy Apply now by clicking the "Apply Now" button.

Vacancy expired!

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